Hot Embossing Technology
The hot embossing (nanoimprinting) equipment can be used to mass-produce microscopic structures, micro optical components, etc.
Emboss casting is done by transcribing microscopic patterns from master dies to resin sheets.
- Integrated optical components
- Diffraction optical components
- Micro-optical components
|Manufactured by Jenoptik AG
|Emboss pressing pressure (variable)||200kN|
|Emboss pressing pressure step||10N|
|Embossing time required Typical cycle time||5 – 20 min|
|Chamber Temperature||Less than 220℃|
|Degree of vacuum||Less than 1millibar|
|Work Size||150 x 150mm|
|Possible embossing area||φ100mm|
|Possible embossing thickness||フィルム～10mm|
|Materials that can be embossed||PMMA, PS, PC, COC, etc.|